Specifications

Sample cooling assembly

Type:2-stage flow cryostat (sample + radiation shield)
Radiation shielding:Radiation shield with top viewport surrounds sample
Cooling source:Liquid helium (LHe) or liquid nitrogen (LN2)
  
Magnetic field:Not an option

Temperature1

Base temperature Control range Configuration
4.5 K5 K to 475 KUp to 6 probe arms installed
3.5 K4 K to 475 Kwith PS-LT option

1Base temperature assumes heat load for probes thermally anchored as listed in probing section

Control stability

Sample stage temperature Helium stability Nitrogen stability
Base temperature (no heater control)±20 mK±20 mK
<10 K±50 mK
10 K to 100 K±20 mK±50 mK
101 K to 250 K±20 mK±50 mK
251 K to 350 K±20 mK±100 mK
351 K to 475 K±50 mK±100 mK

Vacuum

Standard TPS-FRG
Pump down time30 min
(to reach <1 × 10-3 Torr)
Room temperature<5 × 10-4 Torr
Helium base temperature<1 × 10-5 Torr
Maximum temperature<5 × 10-3 Torr

Cycle time (LHe):3.5 h
Vacuum pump down:0.5 h
Station cooldown:1.5 h
Station warmup:1.5 h

Vibration at sample:<30 nm standard

Sample 
Maximum sample size:102 mm (4 in) diameter
Sample backside optical access:Not an option
Sample rotation:±5° in-plane rotation
Sample translation:Translation in x- and y-axis for full 102 mm (4 in) wafer probing

Probing configurations 
Maximum probes:6
Probe arm sensor:Included for monitoring probe temperature
Cooled probe mounts:<30 K with sample at base temperature
Probe mount:Thermally anchored to sample stage
Probe arm:Thermally anchored to radiation shield
DC/RF probes and DC/RF flexible probes:Electrical isolation >100 GΩ for low leakage measurements
Microwave probes:Frequency range DC up to 67 GHz for RF measurements
Fiber optic probes:Available for electro-optical measurements
Probe landing:All probes can land at single point in a 51 mm (2 in) diameter circle

Cryogen consumption2
Room to base temperature (total):10 liquid L helium; 6 liquid L nitrogen
Helium at 5 K:<5 liquid L/h
Nitrogen at 80 K:<0.5 liquid L/h

2Assumes maximum number of probe arms installed

Station details

Temperature equipment
Sample stage sensor/heater power:DT-670-CU-HT calibrated silicon diode/100 W
Radiation shield sensor/heater power:DT-670C-CU silicon diode/100 W
Probe arm:DT-670C-SD silicon diode (on one probe arm)/no active control
Electronics console:
Temperature controllers:Two Model 336s
Helium transfer line:Large bore S-style helium/nitrogen transfer line with flow control 12.7 mm (0.5 in) top port withdrawal
  
Included sample holder:Removable SH-4.00-G, 102 mm (4 in) maximum sample size, grounded
  
Station footprint:1067 mm (42 in) width × 851 mm (33.5 in) depth
(does not include console)
  
Vacuum chamber
Material:Electroless nickel-plated aluminum
Overall size:406 mm (16 in) outer diameter × 178 mm (7 in) tall
Chamber access:330 mm (13 in) diameter opening
Viewport:102 mm (4.0 in) diameter fused quartz
Viewing area:91 mm (3.6 in) diameter
Pump port:NW 40 with included vacuum isolation valve
Gauge port:NW 25
Gas port:0.25 in NPT with valve
Over pressure safety:3.5 kPa (0.5 psi) pressure relief valve
  
Radiation shielding
Material:Electroless nickel-plated aluminum
Sample access:180 mm (7.1 in) diameter lid
Viewport:159 mm (6.25 in) diameter IR absorbing window
Viewing area:152 mm (6.0 in) diameter
  
Vision system
  
Included kits
Tool kit:Included tools for standard operation
Spares kit:Included kit for common consumable items
Probe starter kit:ZN50R-25-W (qty 2), ZN50R-25-BECU (qty 2), and
ZN50R-CVT-25-W (qty 2) for training
  
Utilities
1-phase voltage:100/120/220/240 VAC (+5%, -10%), 50/60 Hz
1-phase power: 2 kVA recommended
3-phase voltage:Not required
3-phase power:Not required
Cooling water:Not required
  
Approval:All instruments CE marked

Back to the FWPX overview

Probing configurations

Vision system