lipix

Ultra-low temperature Rox™ specifications

General

Recommended excitation1: 20 µV (0.05 K to 0.1 K); 63 µV (0.1 K to 1.2 K); 10 mV or less for T > 1 K

Dissipation at recommended excitation: 7.5 × 10–8 W at 4.2 K

Thermal response time: 0.5 s at 4.2 K, 2.5 s at 77 K

Radiation effects: Recommended — more information

Magnetic field: Not recommended

Reproducibility2: ±15 mK at 4.2 K

Soldering standard: J-STD-001 Class 2

1Recommended excitation for T < 1 K based on Lake Shore calibration procedures using an AC resistance bridge — for more information refer to Appendix D and Appendix E

2Short-term reproducibility data is obtained by subjecting sensor to repeated thermal shocks from 305 K to 4.2 K

Range of use

 Minimum limit Maximum limit
RX-102B-RS0.005 K340 K
RX-102B-CB (discontinued)0.01 K440 K

3Calibrations down to 10 mK available

4Calibrations down to 20 mK available

Calibrated accuracy5

 RX-102B-RSRX-102B-CB (discontinued)
5 mK±1.2 mK6
7 mK±0.8 mK6
10 mK±1 mK±1 mK6
20 mK±2 mK±2 mK
50 mK±4 mK±4 mK
1.4 K ±16 mK±16 mK
4.2 K±16 mK±16 mK
10 K±30 mK±30 mK

5[(Calibration uncertainty)2 + (reproducibility)2] 0.5 for more information see Appendices B, D, and E

6Extrapolated accuracy values are anticipated

Long-term stability

 RX-102B-RSRX-102B-CB (discontinued)
4.2 K±30 mK±30 mK

Physical specifications

 MassLead typeMounting hole diameterSensor materials
RX-102B-RS3.5 g
Two 36 AWG copper leads with heavy build polyimide insulation, 15 cm length, lead ends tinned with 63/37 SnPb solder
Accommodates a #6-32 or M3 screwThick ruthenium dioxide and bismuth ruthenate films on aluminum dioxide substrate with palladium silver contacts; epoxy attachment to OFHC adapter; copper leads indium soldered to chip and heat sunk to copper adapter using varnish, covered with copper radiation shield
RX-102B-CB3.5 gTwo 6 in 36 AWG copper leads with heavy-build polyimide insulation Accommodates a #6-32 or M3 screwThick ruthenium dioxide and bismuth ruthenate films on aluminum dioxide substrate with palladium silver contacts; epoxy attachment to OFHC adapter; copper leads indium soldered to chip and heat sunk to copper adapter using varnish

 

Typical magnetic field-dependent temperature errors ΔT/T (%) at B (magnetic induction)

Rox™ 102B
T (K)2.5 T 8 T14 T19 T
23.2913.8222.5327.95
33.9614.6823.1229.12
43.5313.9222.5728.20
81.537.5313.5017.86
160.272.144.666.58
230.060.792.013.11

Magnetic field dependence data for sample Rox™ RTDs

rox_ts_gr4
RS package
CB package