Specifications

Indium foil/solder

Melting point: 430 K (157 °C)

Thermal conductivity at 293 K (20 °C): 84 W/(m • K)

Superconducting transition: 3.38 K (-270 °C)

Volume resistivity (Ω•m):
8.27 × 10-4 at 273 K (0 °C);
9.00 × 10-4 at 293 K (20 °C);
30.11 × 10-4 at 455 K (182 °C)

Thermal expansion coefficient: 24.8 × 10-6 at 300 K (27 °C)

Magnetism: Diamagnetic

Dimensions: 0.127 mm × 50.8 mm × 50.8 mm (0.005 in × 2 in × 2 in)

Tensile strength: 2.61 MPa to 3.55 MPa (380 psi to 515 psi)

Specific heat: 290 J/(kg • K) at 293 K

High temperature solder

Solidus: 548 K (275 °C)

Liquidus: 575 K (302 °C)

Density: 10.75 g • cm3

Diameter: 0.787 mm (0.031 in)

Ostalloy® 158 solder

Composition of Ostalloy® 158 solder: 49.5% Bi, 27.3% Pb, 13.1% Sn, 10.1% Cd

 Indium foil High temperature solderOstalloy®
Melting point 430 K Solidus 548  liquidus 575 K343.16 K
Electrical thermal conductivity 84 W/(m•k) at 293 K35 W/(m•k) at 293 K18.6 W/(m•k) at 293 K
Resistivity9 × 10-4 Ω•m at 293 K 204 × 10-9 Ω•m at 293 K
Tensile strength 2.61 MPa to 3.55 MPa30 MPa
Density7.3 g/cm310.75 g/cm39.67 g/cm3
Composition99.99% pure Indium 90% Pb 10% Sn 49.5% Bi, 37.3% Pb, 13.1% Sn, 10.1% Cd