Specifications
Standard curve Not applicable
Recommended excitation 10 µA ±0.1%
Maximum reverse voltage (diode) 2 V
Maximum forward current (diode) 500 mA
Dissipation at recommended excitation Typical 50 µW max at 4.2 K, 14 µW at 77 K, 10 µW at 300 K
Thermal response time (typical) P and PL: 100 ms at 4.2 K, 250 ms at 77 K, 3 s at 305 K;
SD: <10 ms at 4.2 K
Use in radiation Recommended for use only in low level radiation – for more information click here
Use in magnetic field Low magnetic field dependence when used in fields up to 5 tesla above 60 K – for more information click here
Reproducibility1 ±10 mK at 4.2 K
1 Short-term reproducibility data is obtained by subjecting sensor to repeated thermal shocks from 305 K to 4.2 K |
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| Range of Use |
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Minimum
Limit |
Maximum Limit |
TG-120-P |
1.4 K |
325 K |
TG-120-PL |
1.4 K |
325 K |
TG-120-SD |
1.4 K |
500 K |
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| Calibrated Accuracy |
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Long-term
stability3 |
1.4 K4 |
±12 mK |
±25 mK |
4.2 K4 |
±12 mK |
±15 mK |
10 K |
±12 mK |
±25 mK |
77 K |
±22 mK |
±15 mK |
300 K |
±32 mK |
±50 mK |
500 K |
±50 mK |
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2 [(Calibration uncertainty)2 + (reproducibility)2 ]0.5
for more information see Appendices B, D, and E
3 Long-term stability data is obtained by subjecting
sensor to 200 thermal shocks from 305 K to 77 K
4 Under 10 K calibration valid in vacuum only |
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Temperature Response
Data Table (typical) |
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TG-120 |
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dV/dT (mV/K) |
1.4 K |
5.3909 |
-97.5 |
4.2 K |
4.7651 |
-214 |
20 K |
2.5341 |
-97.5 |
77 K |
1.4222 |
-1.24 |
300 K |
0.8978 |
-2.85 |
500 K |
0.3778 |
-3.15 |
| Click here for expanded response table |
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| Physical Specifications |
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Mass |
Lead type |
Internal
atmosphere |
Lead
polarity |
Sensor
materials |
TG-120-P |
79 mg |
2 phosphor
bronze, insulated with heavy build
Polyimide |
Air |
Short (+)
Long (–) |
BeO ceramic header set into a gold plated copper cylinder |
TG-120-PL |
20 mg |
2 platinum |
Solid
epoxy |
Short (+)
Long (–) |
Constructed with platinum, Stycast® epoxy, and alumina |
TG-120-SD |
38 mg |
2 platinum,
welded to
package;
CAUTION: leads
are delicate |
Hermetically
sealed in
vacuum |
Positive lead
on right with
package lid
up and leads
toward user |
Chip mounted on sapphire base with alumina body and
lid, Mo/Mn metallization on
base & lid top with nickel and gold plating |
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Typical Magnetic Field-Dependent Temperature Errors5 ΔT/T (%) at B (magnetic induction) |
Package Base Parallel to Field B |
T(K) |
1 T |
2 T |
3 T |
4 T |
5 T |
4.2 |
2.9 |
3.8 |
3.7 |
2.8 |
1 |
30 |
0.2 |
0.2 |
0.3 |
0.3 |
0.2 |
78 |
<0.1 |
<0.1 |
0.17 |
0.16 |
0.1 |
300 |
-0.1 |
-0.1 |
-0.1 |
-0.1 |
-0.1 |
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| 5 To minimize magnetic field-induced temperature errors, the sensor should be oriented so that the package base is perpendicular to the magnetic field flux lines – this results in the diode current being parallel to the magnetic field |
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