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Indium Foil/Solder High Temperature Solder Ostalloy® 158 Solder
     
Melting point: 430 K (157 ºC)

Thermal conductivity at 293 K (20 ºC):
84 W/(m • K)

Superconducting transition: 3.38 K (-270 ºC)

Volume resistivity (W•m):
8.27 × 10-4 at 273 K (0 ºC);
9.00 × 10-4 at 293 K (20 ºC);
30.11 × 10-4 at 455 K (182 ºC)

Thermal expansion coefficient:
24.8 × 10-6 at 300 K (27 ºC)

Magnetism: Diamagnetic

Dimensions: 0.127 mm × 50.8 mm × 50.8 mm
(0.005 in × 2 in × 2 in)

Tensile strength: 2.61 MPa to 3.55 MPa
(380 PSI to 515 PSI)

Specific heat: 290 J/(kg • K) at 293 K
Solidus: 548 K (275 ºC)

Liquidus: 575 K (302 ºC)

Density: 10.75 g • cm3

Diameter: 0.787 mm (0.031 in)
Composition of Ostalloy® 158 Solder :
49.5% Bi, 27.3% Pb, 13.1% Sn, 10.1% Cd
 
 
Indium foil
High temperature solder
Ostalloy®
Melting Point
430 K
Solidus 548 K
Liquidus 575 K
343.16 K
Electrical thermal conductivity

84 W/(m•k) at 293 K

35 W/(m•k) at 293 K
18.6 W/(m•k) at 293 K
Resistivity
9 × 10-4 Wm at 293 K
204× 10-9 W•m at 293 K
Tensile strength

2.61 MPa to 3.55 MPa

30 MPa
Density
7.3 g/cm3
10.75 g/cm3
9.67 g/cm3
Composition
99.99% pure Indium
90% Pb 10% Sn
49.5% Bi, 37.3% Pb,
13.1% Sn, 10.1% Cd
 
 
 
 
 
 
 
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