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Specifications
 
 
Standard curve Not applicable
 
Recommended excitation 10 µA ±0.1%
 
Maximum reverse voltage (diode) 2 V
 
Maximum forward current (diode) 500 mA
 
Dissipation at recommended excitation Typical 50 µW max at 4.2 K, 14 µW at 77 K, 10 µW at 300 K
 
Thermal response time (typical) P and PL: 100 ms at 4.2 K, 250 ms at 77 K, 3 s at 305 K;
SD: <10 ms at 4.2 K
 
Use in radiation Recommended for use only in low level radiation – for more information click here
 
Use in magnetic field Low magnetic field dependence when used in fields up to 5 T above 60 K – for more information click here
 
Reproducibility1 ±10 mK at 4.2 K 1 Short-term reproducibility data is obtained by subjecting sensor to repeated thermal shocks from 305 K to 4.2 K
Range of Use
Minimum
limit
Maximum limit
TG-120-P 1.4 K 325 K
TG-120-PL 1.4 K 325 K
TG-120-SD,
CU-HT
1.4 K 500 K
Calibrated Accuracy
Typical sensor accuracy2
Long-term
stability3
1.4 K4 ±12 mK ±25 mK
4.2 K4 ±12 mK ±15 mK
10 K ±12 mK ±25 mK
77 K ±22 mK ±15 mK
300 K ±32 mK ±50 mK
500 K ±50 mK
2 [(Calibration uncertainty)2 + (reproducibility)2 ]0.5
for more information see
Appendices B , D, and E
3 Long-term stability data is obtained by subjecting
sensor to 200 thermal shocks from 305 K to 77 K
4 Under 10 K calibration valid in vacuum only
Temperature Response Data Table (typical)
TG-120
V (volts) dV/dT (mV/K)
1.4 K 5.3909 -97.5
4.2 K 4.7651 -214
20 K 2.5341 -97.5
77 K 1.4222 -1.24
300 K 0.8978 -2.85
500 K 0.3778 -3.15
Click here for expanded response table
Physical Specifications
Mass Lead type Internal
atmosphere
Lead
polarity
Sensor
materials
TG-120-P 79 mg
2 phosphor
bronze, insulated with heavy build
Polyimide
Air
Short (+)
Long (–)
BeO ceramic header set into a gold plated copper cylinder
TG-120-PL 20 mg 2 platinum
Solid
epoxy
Short (+)
Long (–)
Constructed with platinum, Stycast® epoxy, and alumina
TG-120-SD 38 mg
2 platinum,
welded to
package;
CAUTION: leads
are delicate
Hermetically
sealed in
vacuum
Positive lead
on right with
package lid
up and leads
toward user
Chip mounted on sapphire base with alumina body and
lid, Mo/Mn metallization on base & lid top with nickel and gold plating
Typical Magnetic Field-Dependent Temperature Errors5 ΔT/T (%) at B (magnetic induction)
Package base parallel to field B
T (K) 1 T 2 T 3 T 4 T 5 T
4.2 2.9 3.8 3.7 2.8 1
30 0.2 0.2 0.3 0.3 0.2
78 <0.1 <0.1 0.17 0.16 0.1
300 -0.1 -0.1 -0.1 -0.1 -0.1
5 To minimize magnetic field-induced temperature errors, the sensor should be oriented so that the package base is perpendicular to the magnetic field flux lines – this results in the diode current being parallel to the magnetic field
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