
DT-414 Unencapsulated Silicon Diodes
The Model DT-414 uses the DT-400 bare chip silicon diode mounted on a flat substrate. This chip-level cryogenic temperature sensor offers minimal thermal mass and minimal physical size. Die attachment is with silver epoxy, and the chip is unencapsulated, leaving the fragile gold wires exposed.
DT-421 Miniature Silicon Diode
The DT-421 miniature silicon diode cryogenic temperature sensor is configured for installation on flat surfaces. The DT-421 sensor package exhibits precise, monotonic temperature response over its useful range. The sensor chip is in direct contact with the epoxy dome, which causes increased voltage at 4.2 K and prevents full range Curve 10 conformity. For use below 20 K, calibration is required.
The Lake Shore SD Package—The Most Rugged, Versatile Package in the Industry
The SD package, with direct sensor-to-sapphire base mounting, hermetic seal, and brazed Kovar leads, provides the industry’s most rugged, versatile sensors with the best sample to chip connection. Designed so heat coming down the leads bypasses the chip, it can survive several thousand hours at 500 K (depending on model) and is compatible with most ultra high vacuum applications. It can be indium soldered to samples without shift in sensor calibration. If desired, the SD package is also available without Kovar leads. |