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Cryogenic Temperature Sensor Packages and Mounting Adapters

Cryogenic temperature sensors are available in a variety of packages to facilitate mounting. Included are adapters that allow the sensor to be soldered in place, screwed on, bolted down, inserted into a hole, or inserted through a pressure seal in the form of a thermowell. Gold-plated copper bobbins are available for both diodes and resistors in order to heat sink leads. The chart below summarizes the standard Lake Shore sensor and packaging configurations. Appendix C: Sensor Packaging and Installation discusses techniques for the correct installation of cryogenic temperature sensors. More specific installation notes are included for the bare chip sensors, the SD package, and the CU, DI, CY, and CD adapters. Special packaging is also available – consult Lake Shore for custom orders.

PackagingInstallation instructions
collapse Bare Chip Sensors
BC - Bare chip with 2 copper leads (42AWG)
BG - Bare chip with 2 or 4 gold leads
BR - Bare chip, no leads
collapse Copper Canister Package
AA
CD - Copper bobbin
collapse Hermetically Sealed Package
DT-SD
CO - Clamp
ET - Screw-in
MT - Screw-in (metric)
CU - Copper bobbin (small, 4-lead)
DI - Copper bobbin (small, 2-lead)
CY - Copper bobbin (large, 2-lead)
LR - Half-rounded cylinder
BO - Beryllium oxide heat sink block
CX-SD
TG-120-SD
collapse Platinum Mounting Adapters
AL
AM
collapse Unique Packages
CB
CS-501-GR
DT-414
HR
RF-800
TG-120-P
TG-120-PL
Temperature probes

Packages

Cernox packages Silicon diode packages Germanium packages

Cernox® Packages

Silicon Diode Packages

Germanium, Rox™, Rhodium-Iron,
and Carbon-Glass Packages

Platinum packages Capacitance packages GaAlAs packages

Platinum Packages

Capacitance Packages

GaAlAs Packages

Packaging material:

Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

 

Leads:

​2

Lead material:

​2.5 mil (42 AWG) bare copper 25 mm long wires

Mass:

​≤ 3.0 mg

Packaging material:

Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

Leads:

​2

Lead material:

​2 mil (44 AWG) bare gold 25 mm long wires

Mass:

​≤ 3.0 mg

Packaging material:

Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

Leads:

​none

Mass:

​≤ 3.0 mg

  • Used with Cernox®, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors

Adapter material:

Gold-plated cylindrical copper canister, BeO header, Stycast® epoxy

Leads:

Four 32 AWG × 150 mm (6 in) long
Rox™: Two 32 AWG × 150 mm [6 in] long)

Lead material:

Phosphor bronze insulated with polyimide (Rox™: copper insulated with Formvar®)

Mass:

0.091 g (empty)

Once sensors are installed, total mass increases to 0.197 g to 0.416 g. Refer to individual sensor specifications.

Limitation:

The epoxy limits the upper useful temperature of this configuration to 400 K

  • AA canister sensor soldered into a flat, copper bobbin with the sensor leads thermally anchored to the bobbin
  • Can be mounted to any flat surface with a 4-40 or M3 screw (not supplied)
  • Used with Cernox®, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors

Adapter material:

Copper bobbin, gold-plated (AA canister epoxied to bobbin)

Leads:

0.91 m (36 in), 36 AWG, color-coded, Quad-Lead™

Lead material:

Phosphor bronze Grade A alloy

Limitation:

The epoxy limits the upper useful temperature of this configuration to 378 K

  • Small package designed primarily for bonding or clamping to a flat surface
  • Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting

Packaging material:

Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.

Adapter material:

 

 

Leads:

2

Lead material:

Brazed Kovar

Mass:

30 mg

Limitation:

The useful upper temperature limit of this configuration is
500 K

  • Spring-loaded clamp holds standard SD sensor in contact with the surface of the sample and allows the sensor to be easily changed or replaced
  • Extra clamps are available for frequent relocation of the sensor
  • 4-40 stainless steel screw has a formed shoulder, thus applying correct pressure to the clamp
    •  

    Packaging material:

    ​See SD package

    Adapter material:

    Gold-plated copper (nickel strike); spring is ASTM A313 302 Austenitic steel

    Leads:

    ​See SD package

    Lead material:

    See SD package​

    Mass:

    1.8 g (including SD package and clamp)

    Limitation:

    The useful upper temperature limit of this configuration is 500 K

    • Convenient screw-in package formed by indium soldering a basic SD configuration into a recess in one flat of a hexagonal screw head
    • The head terminates in a standard SAE 6-32 threaded stud allowing the sensor to be threaded into a mounting hole in the sample

    Packaging material:

    See SD package

    Adapter material:

    Gold-plated copper SAE-threaded screw head #6-32

    Leads:

    See SD package

    Lead material:

    See SD package

    Mass:

    1.5 g (including SD package and screw-head)

    Limitation:

    Indium solder limits the upper useful temperature of this configuration to 420 K

    • The MT package is similar to the ET version except the SD package is mounted in a slot in the center of the hexagonal head and the stud is a 3 mm × 0.5 metric thread
    Note: A light coating of vacuum grease on the threads further enhances the thermal contact between the sensor package and the sample.

     

    Packaging material:

    See SD package

    Adapter material:

    Gold-plated copper metric threaded screw head 3 mm × 0.5 metric

    Leads:

    See SD package

    Lead material:

    See SD package

    Mass:

    1.5 g (including SD package and screw-head)

    Limitation:

    Indium solder limits the upper useful temperature of this configuration to 420 K

    • SD packaged sensor indium-soldered into a flat copper bobbin with the leads thermally anchored to that same bobbin
    • HT (high temperature) version is soldered using high temperature (90% Pb, 10% Sn) solder
    • Can be mounted to any flat surface with a 4-40 or M3 screw

    Packaging material:

    ​See SD package

    Adapter material:

    Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder 500 K

    Leads:

    Four 0.91 m (36 in), 36 AWG, color-coded Quad-Lead™
    Note: DT-670-CU-HT diodes have Quad Twist™ leads

    Lead material:

    ​Phosphor bronze alloy

    Mass:

    1.1 g (including SD package and bobbin, excluding leads)

    Limitation:

    The epoxy limits the upper useful temperature of this configuration to 420 K (high temperature CU-HT upper temperature limit is 420 K with Cernox® and 500 K with silicon and GaAlAs diodes)

    • 2-lead version of the CU

    Packaging material:

    ​See SD package

    Adapter material:

    Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder

    Leads:

    0.91 m (36 in), 36 AWG, color-coded, 2-lead ribbon cable

    Lead material:

    ​Phosphor bronze alloy

    Mass:

    1.1 g (including SD package and bobbin, excluding leads)

    Limitation:

    The epoxy limits the upper useful temperature of this configuration to  K (high temperature CU-HT upper temperature limit is 420 K with Cernox® and 500 K with silicon and GaAlAs diodes)420

    • Similar to the DI package, except the bobbin is larger in diameter with a centered mounting hole
    • Relatively large-sized, robust

    Packaging material:

    ​See SD package

    Adapter material:

    Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy)

    Leads:

    Two 0.91 m (36 in), 30 AWG color-coded Teflon®-coated leads

    Lead material:

    ​Stranded copper

    Mass:

    4.3 g (Including SD package and bobbin, excluding leads)

    Limitation:

    ​The epoxy limits the upper useful temperature of this configuration to 400 K

    • With an SD packaged sensor mounted on a slightly-more-than half-rounded cylinder, this package is designed to be inserted into a 3.2 mm (1/8 in) diameter hole

     

    Packaging material:

    ​See SD package

    Leads:

    ​See SD package

    Lead material:

    ​See SD package

    Mass:

    0.2 g (Including SD package and disk)

    Limitation:

    Indium solder limits the upper useful temperature of this configuration to 420 K

    • SD package is soldered to a mounting block and the leads are thermally anchored (without epoxy) to the block via a beryllium oxide insert
    • Since leads can be a significant heat path to the sensing element and can lead to measurement errors when incorrectly anchored, this configuration helps maintain the leads at the same temperature as the sensor
    • Can be mounted to any flat surface with a 4-40 or M3 screw

    Packaging material:

    Gold-plated bolt-on copper block with leads thermally anchored to block (SD indium-soldered to adapter)

    Leads:

    ​See SD package

    Lead material:

    ​See SD package

    Mass:

    1.5 g (including SD package and screw-head)

    Limitation:

    Indium solder limits the upper useful temperature of this configuration to 420 K

    • Small package designed primarily for bonding or clamping to a flat surface
    • Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting

     

    Packaging material:

    Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.

     

    Leads:

    ​2

    Lead material:

    ​Gold-plated copper soldered with 60/40 SnPb

    Mass:

    ​≈ 40 mg

    Limitation:

    ​The useful upper temperature limit of this configuration is 420 K

    • Small package designed primarily for bonding or clamping to a flat surface
    • Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting

     

    Packaging material:

    ​Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.

     

    Leads:

    ​2

    Lead material:

    ​Welded platinum

    Mass:

    ​38 mg

    Limitation:

    The useful upper temperature limit of this configuration is
    500 K

     

    • T-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
    • Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)

    Adapter material:

    6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive)

    Leads:

    ​Two 0.010-inch diameter: 10.160 ±1.270 mm (0.400 ±0.050 in) long

     

    Lead material:

    ​Platinum

    Mass:

    3.8 g

    Limitation:

    The aluminum alloy limits the upper useful temperature of these configurations to 800 K

    • PT-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
    • Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)

     

    Adapter material:

    ​6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive)

    Leads:

    Two 0.010-inch diameter:
    15.240 ±1.270 mm (0.600 ±0.050 in) long

    Lead material:

    ​Platinum

    Mass:

    2.1 g

    Limitation:

    The aluminum alloy limits the upper useful temperature of these configurations to 800 K

    • The RX-102B-CB (1000 Ω at room temperature) is useful down to 10 mK (calibrations available down to 20 mK) and monotonic from 10 mK to 300 K. The unique package design maximizes thermal connection and minimizes heat capacity at ultra low temperatures. The RX-102BCB is not interchangeable to a standard curve and not recommended for use in magnetic fields.
    • Can be mounted to any flat surface with a 4-40 or M3 screw

    Packaging material:

    ​Thick ruthenium dioxide and bismuth ruthenate films on aluminium dioxide substrate with palladium silver contacts; epoxy attachment to OFHC adapter; copper leads indium soldered to chip and heat sunk to copper adapter using VGE 7031 varnish

    Leads:

    ​2

    Lead material:

    ​6 in 36 AWG copper leads with heavy build polyimide insulation

    Mass:

    ​3.5 g

    Limitation:

    ​0.01 K to 40 K

    • Virtually no magnetic field-induced errors
    • Capable of mK control stability in the presence of strong magnetic fields
    • Monotonic in C versus T to nearly room temperature

     

    Leads:

    ​2

    Lead material:

    ​Phosphor bronze with heavy build polyimide attached with epoxy strain relief at sensor

    Mass:

    ​260 mg

    Limitation:

    ​1.4 K to 290 K

    • ​​Temperature range: 1.4 K to 375 K (calibration up to 325 K)
    • Small mass for rapid thermal response
    • Non-magnetic package

     

    Packaging material:

    Alumina base, with metallization: 0.1 µm of molybdenum, 0.2 µm gold

    Leads:

    ​2

    Lead material:

    Gold​

    Mass:

    ​3 mg

    Limitation:

    ​1.4 K to 375 K

    • Non-magnetic package
    • Exposed flat substrate for surface mounting

     

    Packaging material:

    Sensing element is mounted to a platinum disk and covered with a dome of Stycast® 2850 epoxy

    Leads:

    ​2

    Lead material:

    ​Platinum ribbon with tinned 60/40 SnPb solder

    Mass:

    ​23 mg

    Limitation:

    1.4 K to 325 K

    • Monotonically decreasing resistivity from 500 K to 0.65 K (sensitivity (dR/dT) falls off in the region of 30 K)
    • From 100 K to 273 K the resistance changes linearly with temperature to within 1 K
    • Monotonic response at higher temperatures—use over the broad range from 1.4 K to 500 K

    Packaging material:

    Alumina and glass cylindrical case – rhodium-iron alloy wire encapsulated in ceramic

    Leads:

    ​4

    Lead material:

    Platinum wire​

    Mass:

    ​735 mg

    Limitation:

    0.65 K to 500 K

    • Temperature range: 1.4 K to 325 K
    • Reproducibility at 4.2 K: ±10 mK

    Packaging material:

    BeO ceramic header set into a gold plated copper cylinder

    Leads:

    ​2

    Lead material:

    ​Phosphor bronze, insulated with heavy build Polyimide

    Mass:

    ​79 mg

    Limitation:

    ​1.4 K to 325 K

    • ​Temperature range: 1.4 K to 325 K
    • Small mass for rapid thermal response

     

    Packaging material:

    Constructed with platinum, Stycast® epoxy, and alumina

    Leads:

    ​2

    Lead material:

    Platinum​

    Mass:

    ​20 mg

    Limitation:

    ​1.4 K to 325 K

    • Stainless steel-encased probes that provide high reliability sensor performance in a thermowell
    • Sealed to keep electrical components and wiring protected from fluids
    • Ideal for temperature measurements in fluid containers and tanks
    • Hermetic feedthrough at the end
    • Also beneficial for extended sensor reach in narrow spaces
    • Available in standard lengths up to 28 in (0.7 m) long
    • Custom lengths and configurations also available

    The Lake Shore SD Package—the Most Rugged, Versatile Package in the Industry

    The SD package, with its sapphire base, direct sensor-to-sapphire mounting, hermetic sealing, and brazed Kovar leads provides the industry's most rugged, versatile sensors with the best thermal connection between the sample and sensor chip. In addition, this package is designed so heat coming down the leads bypasses the sensor chip. It can survive several thousand hours at 500 K and is compatible with most ultra high vacuum applications, and can be indium soldered to samples.
     
    The Lake Shore SD package is now available with Cernox® resistors and GaAlAs diodes, as well as silicon diodes. For the Cernox® resistors and GaAlAs diodes, the Kovar leads are replaced with nonmagnetic leads.