| DT-SD | DT-670 Silicon Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | | |  | - Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal. | | | | | The useful upper temperature limit of this configuration is
500 K | | | DT-SD |
| BC | Cernox | Bare Chip Sensors | Bare chip with 2 copper leads (42AWG) | |  | | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)
| | | 2.5 mil (42 AWG) bare copper 25 mm long wires | | | | | BC |
| BG | Cernox | Bare Chip Sensors | Bare chip with 2 or 4 gold leads | |  | | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models) | | | 2 mil (44 AWG) bare gold 25 mm long wires
| | | | | BG |
| BR | Cernox; Ruthenium Oxide (Rox™) | Bare Chip Sensors | Bare chip, no leads | |  | | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models) | | | | | | | | BR |
| CO | Cernox; DT-670 Silicon Diodes; Model DT-400 Silicon Diodes; GaAlAs Diodes | Hermetically Sealed Package | Clamp | |  | | | Gold-plated copper (nickel strike); spring is ASTM A313 302 Austenitic steel | | | 1.8g (including SD package and clamp) | The useful upper temperature limit of this configuration is 500 K | | | CO |
| ET | Cernox; DT-670 Silicon Diodes; GaAlAs Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Screw-in | |  | - Convenient screw-in package formed by indium soldering a basic SD configuration into a recess in one flat of a hexagonal screw head
- The head terminates in a standard SAE 6-32 threaded stud allowing the sensor to be threaded into a mounting hole in the sample
| | Gold-plated copper SAE-threaded screw head #6-32 | | | 1.5 g (including SD package and screw-head) | Indium solder limits the upper useful temperature of this configuration to 420 K | | | ET |
| MT | Cernox; DT-670 Silicon Diodes; GaAlAs Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Screw-in (metric) | |  |
Note: A light coating of vacuum grease on the threads further enhances the thermal contact between the sensor package and the sample.
| | Gold-plated copper metric threaded screw head 3 mm × 0.5 metric | | | 1.5 g (including SD package and screw-head) | Indium solder limits the upper useful temperature of this configuration to 420 K | | | MT |
| CU | Cernox; DT-670 Silicon Diodes; Model DT-400 Silicon Diodes; GaAlAs Diodes | Hermetically Sealed Package | Copper bobbin (small, 4-lead) | |  | - SD packaged sensor indium-soldered into a flat copper bobbin with the leads thermally anchored to that same bobbin
- HT (high temperature) version is soldered using high temperature (90% Pb, 10% Sn) solder
- Can be mounted to any flat surface with a 4-40 screw
| | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder 500 K | Four 0.91 m (36 in), 36 AWG, color-coded Quad-Lead™
Note: DT-670-CU-HT diodes have Quad Twist™ leads | | 1.1 g (including SD package and bobbin, excluding leads) | The epoxy limits the upper useful temperature of this configuration to 378 K (high temperature CU-HT upper temperature limit is 420 K with Cernox™ and 500 K with silicon and GaAlAs diodes) | | | CU |
| DI | Cernox; DT-670 Silicon Diodes; GaAlAs Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Copper bobbin (small, 2-lead) | |  | | | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder | 0.91 m (36 in), 36 AWG, color-coded, 2-lead ribbon cable | | 1.1 g (including SD package and bobbin, excluding leads) | The epoxy limits the upper useful temperature of this configuration to 378 K (high temperature CU-HT upper temperature limit is 420 K with Cernox™ and 500 K with silicon and GaAlAs diodes) | | | DI |
| CY | Cernox; DT-670 Silicon Diodes; GaAlAs Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Copper bobbin (large, 2-lead) | |  | - Similar to the DI package, except the bobbin is larger in diameter with a centered mounting hole
- Relatively large-sized, robust
| | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy) | Two 0.91 m (36 in), 30 AWG color-coded Teflon®-coated leads | | 4.3 g (Including SD package and bobbin, excluding leads) | The epoxy limits the upper useful temperature of this configuration to 400 K | | | CY |
| LR | Cernox; DT-670 Silicon Diodes; GaAlAs Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Half-rounded cylinder | |  | - With an SD packaged sensor mounted on a slightly-more-than half-rounded cylinder, this package is designed to be inserted into a 3.2 mm (1/8 in) diameter hole
| | | | | 0.2 g (Including SD package and disk) | Indium solder limits the upper useful temperature of this configuration to 420 K | | | LR |
| BO | Cernox; DT-670 Silicon Diodes; Model DT-400 Silicon Diodes | Hermetically Sealed Package | Beryllium oxide heat sink block | |  | - SD package is soldered to a mounting block and the leads are thermally anchored (without epoxy) to the block via a beryllium oxide insert
- Since leads can be a significant heat path to the sensing element and can lead to measurement errors when incorrectly anchored, this configuration helps maintain the leads at the same temperature as the sensor
| Gold-plated bolt-on copper block with leads thermally anchored to block (SD indium-soldered to adapter) | | | | 1.5 g (including SD package and screw-head) | Indium solder limits the upper useful temperature of this configuration to 420 K | | | BO |
| AL | Ruthenium Oxide (Rox™) | Platinum Mounting Adapters | | |  | - T-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
- Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)
| | 6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive) | Two 0.010-inch diameter: 10.160 ±1.270 mm (0.400 ±0.050 in) long
| | | The aluminum alloy limits the upper useful temperature of these configurations to 800 K | | | AL |
| AA | Cernox; Germanium; Ruthenium Oxide (Rox™) | Copper Canister Package | | |  | - Used with Cernox™, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors
| | Gold-plated cylindrical copper canister, BeO header, Stycast® epoxy | Four 32 AWG × 150 mm (6 in) long
Rox™: Two 32 AWG × 150 mm [6 in] long) | Phosphor bronze insulated with polyimide (Rox™: copper insulated with Formvar®) | 0.091 g (empty)
Once sensors are installed, total mass increases to 0.197 g to 0.416 g. Refer to individual sensor specifications. | The epoxy limits the upper useful temperature of this configuration to 400 K | | | AA |
| CD | Cernox; Germanium; Ruthenium Oxide (Rox™) | Copper Canister Package | Copper bobbin | |  | - AA canister sensor soldered into a flat, copper bobbin with the sensor leads thermally anchored to the bobbin
- Can be mounted to any flat surface with a 4-40 screw (not supplied)
- Used with Cernox™, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors
| | Copper bobbin, gold-plated (AA canister epoxied to bobbin) | 0.91 m (36 in), 36 AWG, color-coded, Quad-Lead™ | Phosphor bronze Grade A alloy | | The epoxy limits the upper useful temperature of this configuration to 378 K | | | CD |
| AM | Platinum | Platinum Mounting Adapters | | |  | - PT-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
- Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)
| | 6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive) | Two 0.010-inch diameter:
15.240 ±1.270 mm (0.600 ±0.050 in) long | | | The aluminum alloy limits the upper useful temperature of these configurations to 800 K | | | AM |
| CB | Ruthenium Oxide (Rox™) | Unique Packages | | |  | - The RX-102B-CB (1000 Ω at room temperature) is useful down to 10 mK (calibrations available down to 20 mK) and monotonic from 10 mK to 300 K. The unique package design maximizes thermal connection and minimizes heat capacity at ultra low temperatures. The RX-102BCB is not interchangeable to a standard curve and not recommended for use in magnetic fields.
| Thick ruthenium dioxide and bismuth ruthenate films on aluminium dioxide substrate with palladium silver contacts; epoxy attachment to OFHC adapter; copper leads indium soldered to chip and heat sunk to copper adapter using VGE 7031 varnish | | | 6 in 36 AWG copper leads with heavy build polyimide insulation | | | | | CB |
| CS-501-GR | Capacitance | Unique Packages | CS-501-GR | |  | - Virtually no magnetic field-induced errors
- Capable of mK control stability in the presence of strong magnetic fields
- Monotonic in C versus T to nearly room temperature
| | | | Phosphor bronze with heavy build polyimide attached with epoxy strain relief at sensor | | | | | CS-501-GR |
| DT-414 | Model DT-400 Silicon Diodes | Unique Packages | DT-414 | |  | | Alumina base, with metallization: 0.1 µm of molybdenum, 0.2 µm gold | | | | | | | | DT-414 |
| HR | DT-670 Silicon Diodes; Model DT-400 Silicon Diodes | Unique Packages | | |  | - Non-magnetic package
- Exposed flat substrate for surface mounting
| Sensing element is mounted to a platinum disk and covered with a dome of Stycast® 2850 epoxy | | | Platinum ribbon with tinned 60/40 SnPb solder | | | | | HR |
| RF-800 | Rhodium-Iron | Unique Packages | RF-800 | |  | - Monotonically decreasing resistivity from 500 K to 0.65 K (sensitivity (dR/dT) falls off in the region of 30 K)
- From 100 K to 273 K the resistance changes linearly with temperature to within 1 K
- Monotonic response at higher temperatures—use over the broad range from 1.4 K to 500 K
| Alumina and glass cylindrical case – rhodium-iron alloy wire encapsulated in ceramic | | | | | | | | RF-800 |
| TG-120-P | GaAlAs Diodes | Unique Packages | TG-120-P | |  | | BeO ceramic header set into a gold plated copper cylinder | | | Phosphor bronze, insulated with heavy build Polyimide | | | | | TG-120-P |
| TG-120-PL | GaAlAs Diodes | Unique Packages | TG-120-PL | |  | - Temperature range: 1.4 K to 325 K
- Small mass for rapid thermal response
| Constructed with platinum, Stycast® epoxy, and alumina | | | | | | | | TG-120-PL |
| CX-SD | Cernox | Hermetically Sealed Package | | |  |
- Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.
| | | Gold-plated copper soldered with 60/40 SnPb | | The useful upper temperature limit of this configuration is
500 K | | | CX-SD |
| TG-120-SD | GaAlAs Diodes | Hermetically Sealed Package | | |  |
- Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.
| | | | | The useful upper temperature limit of this configuration is
500 K
| | | TG-120-SD |